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International development status of CMP equipment industry

Published on: September 29, 2019 by Zetian Technology

The earliest CMP technology was developed in the East Fishkill plant by IBM in the mid-1980s using strasbaugh's polishing machine. In 1988, IBM began to apply CMP technology to the manufacture of 4mdram devices. In 1990, IBM sold the 4 mdram process using CMP technology to micron technology. Soon after that, he cooperated with Motorola to produce PC machine parts for Apple computer company. Since then, all kinds of logic circuits and memories have developed to CMP in different scales. By 1994, with the mass production of 0.5 μ m devices and the development of 0.35 μ m process, CMP technology has gradually entered the production line, and the equipment market has initially formed.

The development of CMP technology can be divided into three stages: the first stage is before copper process. Before the copper wiring process, the main grinding materials of CMP were tungsten and oxide; the second stage was from 1997 to 2000. After entering the metal double inlay process, the abrasive materials are expanded from silica to fluorosilicate glass (FSG), which corresponds to the process from 0.25 μ m to 0.13 μ m; the third stage is copper interconnection and low-k medium. The main grinding objects of CMP are internal interconnection layer and shallow channel isolation (STI) layer. The grinding materials are copper and dielectric materials. At present, CMP technology has developed into a chemical mechanical planarization technology, which integrates online detection, cleaning, drying and other technologies.

The main foreign CMP suppliers are applied material, Peter Wolters, Ebara, Novellus, speedfam IPEC and Tokyo precision. The CMP equipment launched is mainly aimed at large-scale (200 mm-300 mm) silicon wafer processing and integrated circuit manufacturing (below 90 nm node) copper interconnection technology field. At present, the international 300 mm CMP products are: applied material's reflexiontm series, Peter Wolters's Apollo PM300, Ebara's frex300, Novellus xcedatm series and speedfam IPEC's momentum 300tm equipment. Among them, CMP equipment of applied material and Novellus is mainly used in the field of IC manufacturing copper interconnection process. The CMP equipment of Peter Wolters and speedfam IPEC is widely used in the field of silicon wafer processing.

Applied material, USA

American applied materials is the largest semiconductor equipment supplier in the world, and also the largest CMP equipment supplier in the world, occupying more than 60% of the CMP market in the world. Applied material launched its first Mirra CMP product in 1997. After that, with its global service and performance guarantee resource advantages, through the merger of obsidian company, it sold more than 1000 CMP equipment to the market in a short period of 5-6 years, becoming the dominant player in the CMP equipment market. Applied material company focuses on rotary CMP equipment, often uses cerium oxide (CE) grinding fluid, and has been mature in STI CMP process. It has occupied 80% of the copper CMP market for IC manufacturing. Am's latest reflex LK is its upgraded product, which adopts Zetian sensor's more flexible design platform, and is aimed at 130 Nm-65 nm mass production equipment.

Fig. 1 Outline of reflexiontm-lk 300 equipment of Applied Materials Company

Peter Wolters, Germany

Peter Wolters is a well-known semiconductor equipment manufacturer in Europe. He has been focusing on the research and development of CMP equipment. He has a unique design and understanding in the field of silicon CMP. CMP equipment produced by Peter Wolters company mainly includes: pm200 Apollo, PM 200 Gemini, PM300 Apollo, HFP 200, HFP 300, etc. All of them are rotary CMP equipment. The PM300 Apollo O type is a 300 mm silicon wafer CMP processing equipment, which can realize the function of "dry in and wet out" or "dry in and dry out" according to different configurations. HFP 300 is the latest 300 mm wafer processing equipment developed by Peter Wolters, which is more efficient.

Figure 2 the outline of hfp300 equipment of Peter Wolters company

Ebara Manufacturing Institute, Japan

Ebara's rotary CMP polishing equipment has consistently maintained the second largest sales volume in the world in recent years. The main equipment models are f * rex200 and f * rex300. Among them, frex300 is for 300 mm IC manufacturing equipment. At the same time, the company is applying electric field grinding technology, etching technology and ultra pure water grinding fluid technology to the development of low-pressure chemical mechanical polishing equipment for 65nm node Cu / LK. So far, more than 800 sets of CMP equipment have been sold.

Fig. 3 outline of f * rex300 equipment manufactured by Ebara in Japan

The performance configuration of the above three international mainstream equipment is shown in Table 1. It can be found from the table that the technical parameters and configuration of products from different companies are similar, which indicates that CMP process is relatively mature and stable.

Equipment supplier

Applied material

Peter Wolters

Ebara

model

Reflexion-LK300

HFP300

PM300 Apollo

F*REX300

wafer diameter

300 mm

300 mm

300 mm

300 mm

System structure

Work in and out

four Polish your head /3 Polishing table

Dry in and wet out

four Polish your head /2 Polishing table

Dry in and wet out

two Polish your head /4 Polishing table

Dry in and wet out

two Polish your head /2 Polishing table

Wafer transmission mode

Automatic transmission

Automatic transmission

Automatic transmission

Automatic transmission

Polish your head

speed

30-200 rpm

0-120rpm

0-125rpm

10-120rpm

Back pressure

10-180kPa

0-200kPa

0-200kPa

5-70kPa

Downforce

345N-3450N

300-5000N

0-4000N

10-70kPa

Polishing table

diameter

/

900mm

Main polishing table: 900mm

Secondary polishing table: 430mm

900mm

speed

30-200 rpm

0-125rpm

Main polishing table: 0-125rpm

Secondary polishing table: 0-125rpm

10-150rpm

temperature

/

20-60

Main polishing table: 20-60

Secondary polishing table: 20-60

20-60

Polishing pad dressing plate

Downforce

/

0-350N

0-350N

50-300N

diameter

/

120mm

120mm

260mm

speed

/

0-80rpm

0-80rpm

10-150rpm

Zetian sensing

 

 

 

Emery disc

Control interface

SECS II / SEMI

SECS II /GEM

SECS II /GEM CIM

SEMI

application area

Copper copperated and flattened

Silicon wafer processing

Silicon wafer processing

Silicon wafer processing